Soldering an electronics package to a motherboard

ABSTRACT

In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of the first and second contacts. The method further includes bonding the first contact to the second contact by melting the interlayer to diffuse the interlayer into the first and second contacts. The bonded first and second contacts have a higher melting temperature than the interlayer before melting. In other example embodiments, an electronic assembly includes a motherboard having a first contact that is bonded to a second contact on an electronic package. An interlayer is diffused within the first and second contacts such that they have a higher melting temperature than the interlayer before the interlayer is diffused into the first and second contacts.

This application is a divisional of U.S. patent application Ser. No.10/808,192, filed on Mar. 24, 2004, now issued as U.S. Pat. No.7,357,293, which is incorporated herein by reference.

TECHNICAL FIELD

Some example embodiments of the present invention relate to connectingan electronic package to a motherboard, and more particularly, tosoldering an electronic package to a motherboard.

BACKGROUND

The current paths in electronic assemblies that include processors arecontinually being required to handle ever-increasing amounts of currentin order to power the processors. Processors typically require morepower in order to operate at higher frequencies and to simultaneouslyperform numerous logic and memory operations. Each increase inprocessing speed and power generally carries a cost of increased heatgeneration within electronic assemblies that include processors. Asprocessor power densities continue to increase, so too does thestructural and thermal challenge of adhering electronic packages thatinclude processors to a motherboard.

One example method of attaching an electronic package to a motherboardincludes soldering the electronic package to the motherboard. Onedrawback with soldering the electronic package to the motherboard isthat the various components contract at different rates during bondingdue to differences in the coefficients of thermal expansion for thematerials that form the electronic package, solder and motherboard.Since the electronic package, solder and motherboard contract atdifferent rates, stress forms within the electronic package, solder andmotherboard as the solder hardens to bond the electronic package to themotherboard.

Most conventional solders have re-flow temperatures around 183° C. andabove. This relatively high re-flow temperature leads to significanttemperature changes within the electronic package, solder andmotherboard as the solder is re-flowed to connect an electronic packageto a motherboard. The large temperature change generates significantexpansion and contraction within the electronic package, solder andmotherboard as the solder is re-flowed and then cooled. The significantexpansion and contraction causes stress within the components as thesolder hardens. The stress within the components makes the electronicassemblies that include such components vulnerable to unwanted cracking.

One example relates to when a motherboard is mounted within a chassisthat is shipped to an end user. The electronic package, solder andmotherboard within such electronic assemblies are under stress such thatthey are particularly vulnerable to the shock and vibration forcesgenerated during shipping.

In addition, the high re-flow temperature of some solders is simply notacceptable for many heat-sensitive devices (e.g., optoelectronicdevices). Many electronic assemblies require a re-flow temperature thatis less than 125° C. in order to connect an electronic package to amotherboard.

Devices that require a low re-flow temperatures leave only a smallthermal window for assembly, as many devices operate at a workingtemperature around 80° C. The small thermal window is problematicbecause there are a limited number of solders that have such a lowmelting temperature (T_(m)). In addition, many low T_(m) solders alsoinclude an undesirable toxic element (e.g., cadmium).

There are some conventional solders that have a T_(m) around 100° C. orless. Solders with such low T_(m) typically cannot be used in mostelectronic assemblies because their T_(m) is too close to, or below, theworking temperature of many electronic assemblies.

One available alternative is to use adhesives to attach an electronicpackage to a motherboard. However, adhesives are limited in both thermaland electrical conductivity. Solder alloys are desirable because oftheir relatively high electrical and thermal conductivities.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a method that includes engaging a first contact on amotherboard with a second contact on an electronic package.

FIG. 2 is a schematic section view of an electronic assembly before anelectronic package is bonded to a motherboard.

FIG. 3 is an enlarged schematic view illustrating an assembled portionof the electronic assembly shown in FIG. 2.

FIG. 4 is an enlarged schematic view similar to FIG. 3 that illustratesanother example embodiment of an assembled portion of the electronicassembly shown in FIG. 2.

FIG. 5 is a block diagram of an electronic system that incorporates theelectronic assembly shown in FIG. 2.

DETAILED DESCRIPTION

The following detailed description references the accompanying drawings.Like numerals describe substantially similar components throughout eachof the drawings. Other embodiments may be used, and structural, logical,and electrical changes made. The integrated circuit described herein canbe manufactured, used, or shipped in a number of positions andorientations.

FIG. 1 illustrates one example embodiment of a method 10 that includes15 engaging a first contact on a motherboard with a second contact on anelectronic package. A portion of one of the first and second contacts iscovered with an interlayer that has a lower melting temperature thanboth of the first and second contacts. The method further includes 20bonding the first contact to the second contact by melting theinterlayer to diffuse the interlayer into the first and second contacts.The bonded first and second contacts have a higher melting temperaturethan the interlayer before melting.

In some embodiments, 20 bonding the first contact to the second contactincludes exposing the interlayer and the first and second contacts to anenvironment having a temperature greater than the melting temperature ofthe interlayer but below the melting temperature of the first and secondcontacts. As an example, the interlayer and the first and secondcontacts may be exposed to a temperature less than 125° C. In addition,exposing the interlayer and the first and second contacts to anenvironment may include maintaining the interlayer and the first andsecond contacts within the environment until (i) a portion of theinterlayer diffuses into the first and second contacts; (ii) a majorityof the interlayer diffuses into the first and second contacts; or (iii)the interlayer is substantially diffused into the first and secondcontacts.

Exposing the interlayer and the first and second contacts to anenvironment may also include exposing the interlayer and the first andsecond contacts to the environment for a period of time (e.g., minutes,hours or days). The interlayer and the first and second contacts may beexposed to the environment until the interlayer melts and thensolidifies within the first and second contacts. It should be noted thatthe longer the interlayer and the first and second contacts are exposedto the environment, the more the interlayer may be diffused into thefirst and second contacts.

It should be noted that 20 bonding the first contact to the secondcontact by melting the interlayer to diffuse the interlayer into thefirst and second contacts may be done at a relatively low temperaturedepending on the type of interlayer. Bonding at a relatively lowtemperature reduces the stress in the bond between the electronicpackage and motherboard.

Once the interlayer is diffused into the first and second contacts, there-flow temperature of the bonded first and second contacts is higherthan the original melting temperature of the interlayer. The higherre-flow temperature allows an electronic assembly that includes anelectronic package bonded to a motherboard to operate at highertemperatures.

The method 10 may further include 22 covering a portion of one of afirst contact and a second contact with an interlayer (e.g., byelectroplating, among other processes). It should be noted that 22covering the portion of one of the first and second contacts with theinterlayer may include (i) covering a portion of both of the first andsecond contacts with the interlayer; and/or (ii) covering all exposedportions of one of the first and second contacts with the interlayer.

FIG. 2 illustrates an electronic assembly 50 that includes a motherboard52 and an electronic package 54. The motherboard 52 includes a firstcontact 56 that is bonded to a second contact 58 on electronic package54. Electronic assembly 50 further includes an interlayer 60 that isdiffused within first contact 56 and second contact 58 when electronicpackage 54 is bonded to motherboard 52 (see FIGS. 3 and 4). The bondedfirst and second contacts 56, 58 have a higher melting temperature thanthe interlayer 60 before the interlayer 60 is diffused into the firstand second contacts 56, 58.

In the example embodiment shown in FIG. 2, first contact 56 is a pad andsecond contact 58 is a ball. It should be noted that first and secondcontacts 56, 58 may be any size, shape or geometry that permits theelectronic package 54 to be bonded to motherboard 52.

In addition, first and second contacts 56, 58 may be made from the samematerial or different materials. Some example materials for first andsecond contacts 56, 58 include gold, silver, copper, tin and alloyscomprised of any combination of tin, bismuth, lead and/or indium as longas the first and second contacts 56, 58 have a higher meltingtemperature than the interlayer 60. Some example materials forinterlayer 60 include:

INTERLAYER (% BY WEIGHT) (T_(m)) ° C. 52In—48Sn 118 66.3Bi—33.4In—0.3Zn107.86 46Bi—34Sn—20Pb 96 52.2In—47.4Sn—0.4Zn 85.7 57Bi—26In—17Sn 7966.3In—33.7Bi 72 66.9In—22.6Bi—0.5Zn 67.7 51In—32.5Bi—16.5Sn 6049Bi—21In—18Pb—12Sn 58

FIG. 3 shows that interlayer 60 is uniformly diffused within first andsecond contacts 56, 58. It should be noted that in other embodimentsinterlayer 60 may not be uniformly diffused into first and secondcontacts 56, 58. As an example, FIG. 4 shows that interlayer 60 may bediffused within first and second contacts 56, 58 such that much ofinterlayer 60 is located near the area 63 where first contact 56 wasmated with second contact 58. The degree of diffusion that interlayer 60has within first and second contacts 56, 58 will depend on thetemperature at which interlayer 60 is re-flowed, and the amount of timethat interlayer 60 and first and second contacts 56, 58 are exposed tothe re-flow temperature.

The types of materials that are selected for the interlayer 60 and thefirst and second contacts 56, 58 will depend on the application wherethe electronic assembly 50 is to be used. One important factor toconsider when selecting materials is that there should be minimalformation of inter-metallic compounds between interlayer 60 and thefirst and second contacts 56, 58.

The melting temperature of the bonded first and second contacts 56, 58is determined by (i) the types of materials that are used for interlayer60 and first and second contacts 56, 58; and (ii) the degree ofdiffusion of interlayer 60 within first and second contacts 56, 58. Insome embodiments, the bonded first and second contacts 56, 58 have amelting temperature greater than 150 degrees centigrade.

The size, type and alignment of electronic package 54 may vary dependingon the design of electronic assembly 50. In addition, the components inelectronic assembly 50 will be determined based on the space availableand the application where electronic assembly 50 is to be used (amongother factors).

As shown in FIG. 2, electronic package 54 may include a die 61 that ismounted on a substrate 62. The die 61 and substrate 62 may be at leastpartially encapsulated by a protective material (not shown in FIGS.2-4). Die 61 may be made of semiconducting material that has beenseparated from a wafer. Wafers may be made of semiconducting,non-semiconducting, or combinations of semiconducting andnon-semiconducting materials.

It should be noted that die 61 may be a processor of any type. As usedherein, processor means any type of circuit such as, but not limited to,a microprocessor, a microcontroller, a graphics processor or a digitalsignal processor. Die 61 may also be a custom circuit or anapplication-specific integrated circuit, such as a communicationscircuit for use in wireless devices such as cellular telephones, pagers,portable computers, two-way radios, and similar electronic systems.

FIG. 5 is a block diagram of an electronic system 70 incorporating atleast one electronic assembly (e.g., electronic assembly 50 shown inFIG. 2) described herein. Electronic system 70 may be a computer systemthat includes a system bus 72 which electrically couples the variouscomponents of electronic system 70 together. System bus 72 may be asingle bus or any combination of busses.

Electronic assembly 50 is electrically coupled to system bus 72 and asdiscussed above may include any circuit, or combination of circuits.Electronic system 70 may also include an external memory 80 that in turnmay include one or more memory elements suitable to a particularapplication. Some example memory elements include a main memory 82 inthe form of random access memory (RAM), one or more hard drives 84,and/or one or more drives that handle removable media 86, such asdiskettes, compact disks (CDs) and digital video disks (DVDs). Theelectronic system 70 may also include a display device 88, a speaker 89,and a controller 90, such as a keyboard, mouse, trackball, gamecontroller, microphone, voice-recognition device, or any other devicethat inputs information into the electronic system 70.

In some embodiments, electronic system 70 further includes a voltagesource 77 that is electrically coupled to electronic assembly 50.Voltage source 77 may be used to supply power to a die (e.g., aprocessor) that is within electronic assembly 50.

The methods and electronic assemblies described herein may beimplemented in a number of different embodiments, including anelectronic package, an electronic system, a computer system, and one ormore methods of fabricating an electronic assembly. The elements,materials, geometries, dimensions, and sequence of operations can all bevaried to suit particular packaging requirements.

FIGS. 1-5 are merely representational and are not drawn to scale.Certain proportions thereof may be exaggerated while others may beminimized.

The method described above may provide a solution for bonding anelectronic package to a motherboard. The method may reduce the stresswithin the bond that connects the electronic package and motherboard.The method may also allows an electronic assembly that includes theelectronic package and motherboard to function at higher operatingtemperature than the temperature that is required to bond the electronicpackage to the motherboard. Many other embodiments will be apparent tothose of skill in the art from the above description.

1. An electronic assembly comprising: a motherboard that includes afirst contact; an electronic package that includes a die mounted on asubstrate, the electronic package further including a second contactthat is bonded to the first contact; and an interlayer diffused withinthe first and second contacts such that the bonded first and secondcontacts have a higher melting temperature than the interlayer beforebeing diffused into the first and second contacts.
 2. The electronicassembly of claim 1 wherein the first and second contacts are both madefrom the same material.
 3. The electronic assembly of claim 1 whereinthe interlayer is uniformly diffused within the first and secondcontacts.
 4. The electronic assembly of claim 1 wherein the interlayeris partially diffused within the first and second contacts.
 5. Theelectronic assembly of claim 1 wherein the first contact is a pad andthe second contact is a ball.
 6. The electronic assembly of claim 1wherein the bonded first and second contacts have a melting temperaturegreater than 150 degrees centigrade.
 7. The electronic assembly of claim1 wherein the die is a processor.
 8. The electronic assembly of claim 7wherein the processor is a digital signal processor.
 9. The electronicassembly of claim 1 wherein the second contact extends from thesubstrate.
 10. An electronic system comprising: a bus; a memory coupledto the bus; and an electronic assembly coupled to the bus, theelectronic assembly including a motherboard having a first contact andan electronic package having a second contact bonded to the firstcontact, the electronic package including a die mounted on a substrate,the electronic assembly further including an interlayer diffused withinthe first and second contacts such that the bonded first and secondcontacts have a higher melting temperature than the interlayer.
 11. Theelectronic assembly of claim 10 wherein the first and second contactsare both made from the same material.
 12. The electronic assembly ofclaim 10 wherein the interlayer is uniformly diffused within the firstand second contacts.
 13. The electronic assembly of claim 10 wherein theinterlayer is partially diffused within the first and second contacts.14. The electronic assembly of claim 10 wherein the first contact is apad and the second contact is a ball.
 15. The electronic assembly ofclaim 10 wherein the bonded first and second contacts have a meltingtemperature greater than 150 degrees centigrade.
 16. The electronicassembly of claim 10 wherein the second contact extends from thesubstrate.
 17. The electronic system of claim 10 wherein the electronicsystem includes a display device.
 18. The electronic system of claim 10wherein the memory is a random access memory.
 19. The electronic systemof claim 10 further comprising a voltage source electrically coupled tothe electronic package.
 20. The electronic system of claim 19 whereinthe die is a processor and the voltage source supplies power to theprocessor.